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Lead Frame Plating Equipment

Lead Frame Plating Equipment

Product Category :    Industrial Process Equipments

Supplier                :    Nmtronics India Pvt. Ltd

Key Features of Lead Frame Plating Equipment

  • Used for silver plating on lead frames to enable die attach and wire bonding after stamping or etching.
  • Applies selective silver spots by means of mechanical masking or by photo resist masking.
  • Can operate standalone or can be integrated into solder plating system.


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Product Profile of Lead Frame Plating Equipment

Lead Frame Plating Equipment is used for silver plating on lead frames to enable die attach and wire bonding after stamping or etching. The Frame Plating Equipment applies selective silver spots by means of mechanical masking or by photo resist masking. The Frame Plating Equipment can operate standalone or can be integrated into solder plating system. The Lead Frame Plating Equipment can be availed in different specifications to suit application in various industrial sectors.

Key Features of Lead Frame Plating Equipment
  • Used for silver plating on lead frames to enable die attach and wire bonding after stamping or etching.
  • Applies selective silver spots by means of mechanical masking or by photo resist masking.
  • Can operate standalone or can be integrated into solder plating system.
  • Can be availed in different specifications to suit application in various industrial sectors
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